04-10-2010, 08:59 PM
A friend of mine has been discussing a dead game console with another friend who was one of the main people who diagnoses console failures for the manufacture. It turns out his particular console failure was due to a common problem that has caused many of them to fail.
The root of the issue turns out to be RoHS compliance. Apparently the solder on the PCB has less lead in it to be RoHS compliant, and thus is less flexible. As the PCB heats and cools, eventually the solder cracks. Previous versions of this console were not RoHS compliant and thus didn't have this issue. While some of these consoles are repaired when this happens, most are thrown in the trash.
And that strikes me as odd. While the goal of RoHS was to cut down on toxic electronics being trashed, at least this implementation of it has greatly increased the rate at which PCBs fail.
I don't know enough about solder to know if there was some better way to do it. But I'm curious if anyone knows of any studies that have been done to see if this initiative is successful or not. From the numbers I've found, it seems like if the failure rate increases by more than about 2.5x, on average that means more lead (for example) end up in the dump than previously.
The root of the issue turns out to be RoHS compliance. Apparently the solder on the PCB has less lead in it to be RoHS compliant, and thus is less flexible. As the PCB heats and cools, eventually the solder cracks. Previous versions of this console were not RoHS compliant and thus didn't have this issue. While some of these consoles are repaired when this happens, most are thrown in the trash.
And that strikes me as odd. While the goal of RoHS was to cut down on toxic electronics being trashed, at least this implementation of it has greatly increased the rate at which PCBs fail.
I don't know enough about solder to know if there was some better way to do it. But I'm curious if anyone knows of any studies that have been done to see if this initiative is successful or not. From the numbers I've found, it seems like if the failure rate increases by more than about 2.5x, on average that means more lead (for example) end up in the dump than previously.